Detailed Product Description

In the process of patterning the circuit on the wafer, we keep the wafer thickness uniformly to prevent damage from foreign shock. After finishing patterning on the wafer, we have to grind the backside of the wafer to make it suitable thickness.

In this application, Pressure Sensitive Adhesive (P.S.A) Tape is used to protect the patterned circuit on the wafer.  There are 2 kinds of PSA tapes such as NON-UV Tape and UV curable tape.

Feature:

- As base film is polyolefin, it is free from deficiencies caused by PVC film,such as plasticizer migration, bad odor, and so on.
- It has optimum adhesive strength enough to hold chip during wafer sawing process.
- No contamination on the backside of chip due to deionizer water or silicon dust
- Smooth pick-up can be possible after a period of long storage.
- Very excellent lamination with wafer and easy delimitation from wafer during backside grinding process.
-Completely free from fish-eye, gel, foreign material and so on which may cause damage to wafer.
- As it is free from silicon, detergent and wax compositions in its adhesive, de-lamination of epoxy never occur during package process of chip.

Application:

1. Dicing of water

2. Protection of semiconductor circuits during the process of water backside grinding